Certified interoperability of DDR4/3, LPDDR3/2 Multi-modal PHY and Universal controller combines industry-leading signal integrity and broad configurability
SUNNYVALE and MILPITAS, Calif. – November 18, 2014 – Rambus Inc. (NASDAQ:RMBS) and Mobiveil today announced they have validated interoperability of the Rambus R+™ DDR4 Multi-modal PHY with the Mobiveil Universal Multiport Memory Controller (UMMC) Core for JEDEC standard DDR4/3 and LPDDR3/2 operation. As part of the overall Rambus IP Cores program, the integrated IP provides chipmakers with a pre-validated, industry standard solution that reduces costs and risk by reducing IP qualification time. In addition, the differentiated memory subsystem brings together the superior signal integrity and low power offered by the Rambus R+ multi-modal PHY with the flexibility of the Mobiveil UMMC in a single, easily integrated solution.
“Partnering with Mobiveil to bring a complete offering to market demonstrates both companies’ commitment to meeting customer needs in the face of increasingly complex and costly SoC development,” said Kevin Donnelly, general manager of the Memory and Interface division at Rambus. “By working in a collaborative manner with companies like Mobiveil, we are addressing chip makers needs with proven and ready-to-use IP blocks that minimize qualification and integration time.”
“Our UMMC Controller Core has successfully proven to be both flexible and configurable for real-time consumer applications,” said Ravi Thummarukudy, chief executive officer of Mobiveil. “Pairing our technology with the Rambus R+ multi-modal PHY provides customers with the best DRAM solution for their particular application without changing the SoC, which substantially minimizes design time and development cycles across a broad number of applications.”
The Rambus R+ DDR4/3, LPDDR3/2 multi-modal PHY delivers industry-leading performance while providing SoC makers a comprehensive array of memory choices, ranging from high-performance to low-power applications. To complement its broad applicability, the R+ DDR4/3 multi-modal PHY delivers versatile configuration options for both area- and power-optimized consumer applications and performance-intensive compute applications. Additionally, the enhanced standards IP cores are designed with system-aware methodology to ensure superior signal integrity and system margin for optimal DRAM vendor interoperability. The PHY is available in several low-power foundry processes and can be configured for both flip-chip and wire bond packages with data rates ranging from 800 to 3200Mbps.
Mobiveil’s UMMC Controller is a highly flexible and configurable design. It is targeted for high bandwidth access and low power consumption such as next-generation mobile, networking and consumer applications. The controller architecture is carefully tailored to achieve reliable high-frequency operation with dynamic power management and rapid system debug capabilities. Its flexible AXI System interface makes it easy to be integrated into a wide range of applications.
Mobiveil has joined the Rambus Partner Program, which will enable further collaboration on other combined IP blocks offerings between the two companies. For additional information on the Rambus Partner Program, visit rambus.com/partners.
The LDPC based Flash Reliability solution will be demonstrated at the Intel Development Forum (IDF), 2014 in San Francisco, California, September 9-11. Mobiveil booth number is #176.
About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com
About Mobiveil, Inc.
Mobiveil is a fast‐growing technology company that specializes in development of Silicon Intellectual Properties, platforms and solutions for the networking, storage and enterprise markets. Mobiveil team leverages decades of experience in delivering high‐quality, production‐proven, highspeed serial interconnect Silicon IP cores and custom and standard form factor hardware boards to leading customers worldwide. With a highly motivated engineering team, dedicated integration support, flexible business models, strong industry presence through strategic alliances and key partnerships, Mobiveil solutions have added tremendous value to the customers in executing their product goals within budget and on time. Mobiveil is headquartered in the Silicon Valley with engineering development centers located in Milpitas, CA, Chennai and Bangalore, India, and sales offices and representatives located in US, Europe, Israel, Japan, Taiwan and People Republic of China. For more information, please visit http://www.mobiveil.com
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