LDPC (Low Density Parity Check) Engine – Flash Error Correction Solution for the SSD Market

Santa Clara, CA – April 25, 2017eASIC® Corporation (@easic), a fabless semiconductor company that delivers a custom integrated circuits (IC) platform (eASIC Platform), and Mobiveil, Inc., a fast growing supplier of Silicon Intellectual Properties (SIPs) and Platforms, today announced that Mobiveil’s Flash Reliability IP is now available for use in the eASIC Nextreme-3S family.

The Flash Reliability IP Platform contains an LDPC (Low Density Parity Check) engine with a Flash Interface, Flash Soft-Information Generation and Flash Monitoring and Analysis. The LDPC engine is programmable to support any codeword/parity combination from 512B to over 8KB and supports on-the-fly switching between different LDPC codes.

“eASIC is enabling the rapid deployment of advances in SSD/Flash storage technology at substantially higher performance, lower cost and lower power than alternative rapid deployment solutions”, said Jasbinder Bhoot, Vice President of Worldwide Sales and Marketing at eASIC. “By working with Mobiveil, our customers will have access to a complete SSD solution optimized for eASIC devices.”

“We are pleased to be working with eASIC to extend our Flash Error Correction solution for the SSD market”, said Ravi Thummarukudy, CEO of Mobiveil, Inc. “The combination of our complete Flash Storage IP portfolio that includes ONFI, DDR4/3 PCIe, and NVMe with eASICs devices allow customers to implement solutions that can be immediately and cost effectively taken to market.”

About eASIC

eASIC is a semiconductor company offering a differentiated solution enabling rapid and cost-effective custom ICs, creating value for customers’ hardware and software systems. Our eASIC solution consists of the eASIC platform which incorporates a versatile, pre-defined and reusable base array and customizable single-mask layer, our ASICs, delivered using either our easicopy or standard ASIC methodologies, and our proprietary design tools. We believe this innovative technology allows eASIC to offer the optimal combination of fast time-to-market, high performance, low power consumption, low development cost and low unit cost for our customers. Privately held eASIC Corporation is headquartered in Santa Clara, California. For more information visit www.easic.com.

About Mobiveil, Inc.

Mobiveil is a fast-growing technology company that specializes in the development of Silicon Intellectual Properties (SIPs), platforms and solutions for the networking, storage and enterprise markets. Mobiveil’s team leverages decades of experience in delivering high-quality, production proven, high-speed serial interconnect Silicon IP cores along with customer and standard form factor hardware boards to leading customers worldwide. Mobiveil is headquartered in Silicon Valley with engineering development centers located in Milpitas, CA, Chennai and Bangalore, India and sales offices and representatives located in US, Europe, Israel, Japan, Taiwan, and Peoples Republic of China. For more information, please visit www.mobiveil.com.

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